无卤素低温锡焊膏

Halogen-free low-temperature tinol

Abstract

The invention discloses halogen-free low-temperature tinol which comprises the following components by mass percent: 85-95% of solder powder and 5-15% of scaling powder, wherein the solder powder is Sn-Bi series solder powder, and the scaling powder comprises the following components by mass percent: 35-45% of solvent, 35-45% of film forming agent, 5-10% of active agent, 1-5% of thixotropic agent, 1-2% of antioxygen and 1-3% of the balance. With the adoption of the mode, the stability of the tinol can be improved; the tinol has very high wetting power and a very high expansion rate; and no residue is remained after soldering.
本发明公开了一种无卤素低温锡焊膏,包括按质量百分比组成的下列成分:焊锡粉85-95%,助焊剂5-15%;所述焊锡粉为Sn-Bi系列焊锡粉,所述助焊剂由以下质量百分比的组分组成:溶剂35-45%,成膜剂35-45%,活性剂5-10%,触变剂1-5%,抗氧剂1-2%,其他1-3%。通过上述方式,本发明能够提高锡焊膏的稳定性,具有很高的润湿力和扩展率,且焊后无残留。

Claims

Description

Topics

Download Full PDF Version (Non-Commercial Use)

Patent Citations (0)

    Publication numberPublication dateAssigneeTitle

NO-Patent Citations (0)

    Title

Cited By (1)

    Publication numberPublication dateAssigneeTitle
    CN-103537822-AJanuary 29, 2014广州汉源新材料有限公司High-concentration scaling powder for pre-forming soldering lug spraying